Thermally conductive epoxy encapsulating and potting compound. 100 Percent solids. Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission. RoHS compliant.
- Excellent electrical and thermal conductivity
- Easy 1:1 mix ratio
- Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
- Suitable for large production runs
- Excellent machining properties
- Excellent electrical and thermal conductivity
- Easy 1:1 mix ratio
- Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
- Suitable for large production runs
- Excellent machining properties