Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant.

Buy Now From Amazon

Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant.

  • Epoxy mold release
  • Non-Silicone
  • It allows for a clean removal of the cured epoxy
  • For use with all types of epoxies and phenolic resins
  • Epoxy mold release
  • Non-Silicone
  • It allows for a clean removal of the cured epoxy
  • For use with all types of epoxies and phenolic resins

Similar Products

Tuck Tape Construction Grade Sheathing TapeAGN 134338 Shurtape HW-300 Housewrap Sheathing Tape: 2-1/220 8oz Disposable Graduated Clear Plastic Cups for Mixing Paint, Stain, Epoxy, ResinAllway Tools Series Allway 10031 HM1 1 Gallon Helix Paint Mixer, SilverVariety Pack 1 (10 Colors) Mica Powder Pure, 2TONE Series Variety Pigment Packs (Epoxy,Paint,Color,Art) Black Diamond PigmentsEcoSeal Mold Release Tape 3EcoPoxy - Liquid Plastic (1, 6 Liter - 2:1 Mix)Epoxyseal 9000 Electronic Grade Potting Epoxy Resin