Compound for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics. Applicable for use in electronic assemblies to prevent vibration damage, encapsulate circuits for the purpose of technological protection. RoHS compliant.
- Suitable for very high temperature applications; service temperature range -40 to 225 °C (-40 to 437 °F)
- Extreme resistance to chemicals. water and humidity (allows for submersion where needed)
- 1.7A:1B volume mix ratio
- Extreme compressive and tensile strength
- Excellent electrical insulating characteristics
- Suitable for very high temperature applications; service temperature range -40 to 225 °C (-40 to 437 °F)
- Extreme resistance to chemicals. water and humidity (allows for submersion where needed)
- 1.7A:1B volume mix ratio
- Extreme compressive and tensile strength
- Excellent electrical insulating characteristics