Intel Xeon Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel C624 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.2 Interface: PCIe 3.0 x4 and PCIe 3.0 x4 M.2 Form Factor: 22110 M.2 Key: M-Key (RAID 0,1 support) 1 VGA port(s) Intel C624 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with 10GBase-T with Intel X557
Intel Xeon Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel C624 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, i...
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