* 100% New Heatsink plaster.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200 ℃
* Net Weight: 10g
Do not use thermal glue between CPU Chip and heatsink
Package Includes:
1 x Thermal Heatsink Plaster Glue.
- Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
- Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
- It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
- Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
- Package Includes : 1 x GENNEL G109 10g thermal glue
- Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
- Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
- It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
- Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
- Package Includes : 1 x GENNEL G109 10g thermal glue
