Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F;
Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F

Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F eutectic. Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Size: 5cc/15g syringe

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Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F eutectic. Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Size: 5cc/15g syringe

  • Solder Paste
  • Lead Free / RoHS
  • No Clean
  • Syringe
  • Low Temprature
  • Solder Paste
  • Lead Free / RoHS
  • No Clean
  • Syringe
  • Low Temprature

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