The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses. The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer. The lightest of touches is enough to attach them optimally. All pads are ecofriendly and RoHS-compliant. Specifications minus pad 8: W/mK 8.0, temperature range: -100°C / +200°C The minus pads 8 are available in the sizes of 30x30mm, 120x20mm, 100x100mm as well as in the thicknesses of 0,5mm, 1mm, 1,5mm, 2mm.
- 8W/(m·K) THERMAL CONDUCTIVITY - Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
- COMPATIBILITY - Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
- UPGRADE - Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
- GREAT RESULTS - The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
- USECASE - This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
- 8W/(m·K) THERMAL CONDUCTIVITY - Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
- COMPATIBILITY - Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
- UPGRADE - Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
- GREAT RESULTS - The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
- USECASE - This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
