Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
- Weight: 1.0g/tube
- Operation Temperature: -50/180°c
- Thermal Conductivity: >3.17W/m.k
- Thermal Resistance: <0.067°c-in2/w
- 20% metal oxide compounds
- Weight: 1.0g/tube
- Operation Temperature: -50/180°c
- Thermal Conductivity: >3.17W/m.k
- Thermal Resistance: <0.067°c-in2/w
- 20% metal oxide compounds