Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, hi...

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Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.

  • Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
  • High efficient thermal conductive properties
  • High temperature stability
  • Use with heat sinks or metal chassis
  • Contains zincs oxides and polydimenthyl siloxane
  • Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
  • High efficient thermal conductive properties
  • High temperature stability
  • Use with heat sinks or metal chassis
  • Contains zincs oxides and polydimenthyl siloxane

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