Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
- Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
- High efficient thermal conductive properties
- High temperature stability
- Use with heat sinks or metal chassis
- Contains zincs oxides and polydimenthyl siloxane
- Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
- High efficient thermal conductive properties
- High temperature stability
- Use with heat sinks or metal chassis
- Contains zincs oxides and polydimenthyl siloxane